Kāpēc LED mikroshēmām ir nepieciešami zelta vadi iesaiņošanai?

LED Package wires classification

LED Package wires are the wire electrical connection to connect these led chip to the external pins. once this wire has a problem, the LED is damaged, So as there are many different prices in the market, how many types of wires are used for led packages?

The LED Packages has 4 types of quality: gold wires, silver wires, copper wires, and alloy wires.

1. Gold wires

It is Top quality among wires in the high-end package field. it features stable performance, high price. gold is generally used to ensure a stable connection for oxidation resistance.

2. Alloy wires

Sakausējuma vadi ir zelta stiepļu aizstāšana LED nozarē. Pēdējos gados zelta cenas nepārtraukti pieaug, pieaug arī Led paketes stiepļu izmantošana. Tajā pašā laikā tiek samazinātas Led produktu cenas. tāpēc iznāk lētāka alternatīva sakausējuma stieple. Vada galvenā sastāvdaļa ir viens sudraba kristāls, saturs parasti ir 90% -99%. tas sastāv no daudz sudraba uz zelta bāzes un citiem komponentiem dažādiem elementiem.

Iespējas:

1, cena ir lētāka, zemāka par zelta cenu, augstāka par vara cenu,

3, metināmība ir labāka metināšanas laikā;

3, instalējiet nenobriedušu vecmodīgo vadu ierīces pieteikumus

4, viegli oksidējams.

3. Sudraba stieples

it is better storage than copper wires, (copper wire need to be sealed, and the short life for storage; silver wire without sealing, storage of up to 6 to 12 months)Features:1, it is relatively soft, machine parameter adjustment is not large;

2, lower than the current price of gold wire, higher than copper wires.

3, no need gas protection;

4 silver wire gold wire tension is not so strong, but the light decay is better than gold silver because silver is not extinction.

4. Copper Wires

Iespējas:

1, low prices, the cost is only 1 / 3-1 / 10 of gold wires, has great potential to reduce costs.

2, relatively high stiffness copper-gold wire makes it more suitable for fine-wire bonding.

3, copper is easily oxidized, unstable bonding process,

4, copper hardness, yield strength and other physical parameters higher than gold and aluminum.